TI德州仪器无线链接产品数据手册
CC2531F128CC2531F256
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信驰达简介
信驰达科技（RF-star）是一家集合方案设计功能和核心器件供应的专业本地电子元器件分销商，专注低功耗射频LPRF和低功耗MCU领域，公司成立于2010年，作为中国区唯一具有美国TI公司授予的LPRF Product Reseller和Third Party双重资质的公司，一直引领着LPRF技术在国内的推广和应用，是国内唯一一家可提供LPRF软硬件产品、技术支持、解决方案和核心元器件供应一条龙服务的专业化公司；
公司在美国新泽西州、中国深圳、上海、北京、天津、无锡、长沙、成都、重庆设有研发中心和办事处，拥有资深的技术研发团队和销售团队以及SMT生产工厂。
无线射频器件用于低于1GHz和2.4GHz频段、ANT、蓝牙(Bluetooth)、低功耗蓝牙、射频识别（RFID）、PurePath无线音频、ZigBee、IEEE802.15.4、Zigbee RF4CE、6LoWPAN、Wi-Fi的射频集成电路(RF IC)和专有协议。
产品市场应用：ZigBee无线传感网络，各种数据采集及遥测监控(含数据,语音,图像等),可应用于安防、医疗、能源、水力、电力、交通监控、防盗，无线自动抄表；仪器仪表远程数据遥测、工业无线遥控；消防安全自动报警、煤矿安全监控及人员定位；汽车防盗、胎压检测，四轮定位；无线键盘、鼠标、打印机、游戏杆、遥控玩具、机器人等广泛的领域。适用于合乎全世界免费频段315MHz、433MHz、470MHz、868 MHz、915MHz、2.4GHz，符合FCC、CE、SGS、RoHs认证规范,产品和信誉受到国内外顾客的一致好评。
RF-star将一如既往，为客户提供更多、更好的产品，更具优势的技术服务，良好的商务服务，和更完善的物流服务。RF-star将跨上一个新的平台，获得更大的发展空间。RF-star将继续本着“务实、诚信、学习、创新”的专业精神，团结一致、奋勇开拓、锐意进取，为成为全球无线射频技术绝对第一之产品、服务及解决方案提供者，把科技与客户联系在一起，为供应链注入动力，并提供卓越的投资回报而不懈努力。
如果您在产品开发过程中发现技术难题以及高频困扰，竭诚欢迎来电洽询。我们将为您提供技术支持和解决方案，让您能更快把产品推向市场。
我们深信射频技术将会得到迅速的发展与普及，我们愿意分享多年来在射频行业积累的经验与教训，为无线的明天做出贡献。专业源于专注，科技铸就未来。
带USB控制的2.4-GHz IEEE802.15.4and ZigBee片载系统
特征：
?射频/布局
–适用2.4-G IEEE802.15.4的射频收发器
–出色的接收灵敏度和稳定的抗干扰性
–可编程输出功率高达4.5dBm
–只需极少的外接元件
–仅需一个晶振实现网状网网络系统需求
–6mm*6mm的QFN-40封装
–适合系统配置符合世界范围的无线电频率法规：ETSI EN300328和EN300440（欧洲），FCC CFR47第15部分(美国)和ARIB STD-T-66（日本）
?USB
–遵循USB2.0规范的全速器件（12Mbps）
–5个高灵敏度的端口
–1KB专用先入先出存储器（FIFO）
–DMA访问先入先出存储器（FIFO）
–无需48MHz晶振支持
?低功耗
–主动接收模式(CPU空闲状态)：24mA
–主动发射模式，1dBm时（CPU空闲状态）：29mA
–供电模式1（4us唤醒）：0.2mA
–供电模式2（睡眠定时运行）：1uA
–供电模式3（外部中断）：0.4uA
–供电范围：2.0-3.6V
?微处理器
–高性能和低功耗且具有代码预取功能的8051微处理器内核
–256KB或128KB的片上系统可编程闪存
–在各种供电模式下数据保存空间，保持为8KB RAM
–支持硬件调试
?外设
–强大的5通道DMA
–IEEE802.15.4MAC计时器，多功能（通用）计时器（1个16位，2个8位）
–红外生成电路
–32kHz带捕获功能的睡眠计时器
–CSMA/CA硬件支持
–精确的数字RSSI/LQI支持
–电池监视器和温度传感器
–具有8通道输入和可配置分辨率的12位的ADC
–AES安全协处理器
–2个支持多种串行通信协议的强大USART
–21个多功能I/O口（19*4mA,2*20mA）
–看门狗定时器
?开发工具
–CC2531开发套件
–CC2531看门狗设计参考
–SmartRF?软件
–数据包嗅探器
–可用的IAR嵌入式平台
应用：
?带USB的2.4-GHz IEEE802.15.4升级系统
?专用于电视机及机顶盒的RF4CE遥控器
?PC外设
?Zigbee?系统
?家庭、楼宇和工业自动化
?灯光控制系统
?工业控制及监测
?低功耗无线传感网络系统
?消费类电子产品
?医疗、病患监护
描述：
CC2531是一款具有USB操作能力的片上系统解决方案，面向IEEE802.15.4，Zigbee，RF4CE应用，它使得能够以很低的总物料清单成本来设计USB硬件钥匙或可通过USB来实现升级的网络节点。CC2531将一款领先射频收发器的性能与业界标准的增强型8051MCU，在线可编程闪存，8KB RAM及许多其他的强大功能组合在一起，CC2531多重运行模式，使得它适用于要求超低功耗的系统，运行模式的短时间转换，进一步确保了低功耗，CC2531的USB HID源代码，CDC函数库和例程都可以从https://www.doczj.com/doc/5b4742272.html,下载。
由TI提供的zigbee联盟最高业内水平（Z-Stack），CC2531为那些可通过固件进行升级的网络节点提供了一种牢固可靠且完整的硬件钥匙。
RF_P RF_N
B0300-02
CC2531F128,CC2531F256
https://www.doczj.com/doc/5b4742272.html,
SWRS086A –SEPTEMBER 2009–REVISED JUNE 2010
ABSOLUTE MAXIMUM RATINGS (1)
MIN
MAX UNIT Supply voltage
All supply pins must have the same voltage –0.3 3.9
V –0.3
V DD +0.3,
Voltage on any digital pin V ≤3.9
Input RF level
10dBm Storage temperature range –40
125°C All pads,according to human-body model,JEDEC STD 22,method 2kV A114
ESD (2)
According to charged-device model,JEDEC STD 22,method C101
500
V
(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)
CAUTION:ESD-sensitive device.Precautions should be used when handling the device in order to prevent permanent damage.
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RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT Operating ambient temperature range,T A–40125°C Operating supply voltage2 3.6V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted. Boldface limits apply over the entire operating range,T A=–40°C to125°C,V DD=2V to3.6V,and f c=2394MHz to
2507MHz.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Digital regulator on.16-MHz RCOSC running.No radio,
crystals,or peripherals active. 3.4mA
Medium CPU activity:normal flash access(1),no RAM access
32-MHz XOSC running.No radio or peripherals active.
6.58.9mA
Medium CPU activity:normal flash access(1),no RAM access
32-MHz XOSC running,radio in RX mode,–50-dBm input
20.5mA
power,no peripherals active,CPU idle
32-MHz XOSC running,radio in RX mode at–100-dBm input
24.329.6mA
power(waiting for signal),no peripherals active,CPU idle
32-MHz XOSC running,radio in TX mode,1-dBm output
28.7mA
I core Core current consumption power,no peripherals active,CPU idle
32-MHz XOSC running,radio in TX mode,4.5-dBm output
33.539.6mA
power,no peripherals active,CPU idle
Power mode1.Digital regulator on;16-MHz RCOSC and
32-MHz crystal oscillator off;32.768-kHz XOSC,POR,BOD0.20.3mA
and sleep timer active;RAM and register retention
Power mode2.Digital regulator off;16-MHz RCOSC and
32-MHz crystal oscillator off;32.768-kHz XOSC,POR,and12m A
sleep timer active;RAM and register retention
Power mode3.Digital regulator off;no clocks;POR active;
0.41m A
RAM and register retention
Peripheral Current Consumption(Adds to core current I core for each peripheral unit activated)
Timer1Timer running,32-MHz XOSC used90m A Timer2Timer running,32-MHz XOSC used90m A Timer3Timer running,32-MHz XOSC used60m A Timer4Timer running,32-MHz XOSC used70m A I peri Sleep timer Including32.753-kHz RCOSC0.6m A
Measured on CC2531dongle reference design,48-MHz clock
USB0.1mA
running,USB enabled
ADC When converting 1.2mA
Erase1mA Flash
Burst write peak current6mA (1)Normal flash access means that the code used exceeds the cache storage,so cache misses happen frequently.
GENERAL CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKE-UP AND TIMING
Digital regulator on,16-MHz RCOSC and32-MHz crystal
Power mode1→active4m s
oscillator off.Start-up of16-MHz RCOSC
Digital regulator off,16-MHz RCOSC and32-MHz crystal
Power mode2or3→active0.1ms
oscillator off.Start-up of regulator and16-MHz RCOSC
Initially running on16-MHz RCOSC,with32-MHz XOSC off0.5ms Active→TX or RX
With32-MHz XOSC initially on192m s
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GENERAL CHARACTERISTICS(continued)
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RX/TX and TX/RX turnaround192m s USB PLL start-up time With32-MHz XOSC initially on32m s RADIO PART
Programmable in1-MHz steps,5MHz between channels
RF frequency range23942507MHz
for compliance with[1]
Radio baud rate As defined by[1]250kbps Radio chip rate As defined by[1]2MChip/s Flash erase cycles20k Cycles Flash page size2KB
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RF RECEIVE SECTION
Measured on Texas Instruments CC2530EM reference design with T A=25°C,V DD=3V,and f c=2440MHz,unless otherwise noted.
Bold limits apply over the entire operating range,T A=–40°C to125°C,V DD=2V to3.6V,and f c=2394MHz to2507MHz.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PER=1%,as specified by[1]–97–92
Receiver sensitivity dBm
[1]requires–85dBm–88
PER=1%,as specified by[1]
Saturation(maximum input level)10dBm
[1]requires–20dBm
Wanted signal–82dBm,adjacent modulated channel at
Adjacent-channel rejection,5-MHz5MHz,PER=1%,as specified by[1].
49dB channel spacing
[1]requires0dB
Wanted signal–82dBm,adjacent modulated channel at
Adjacent-channel rejection,–5-MHz–5MHz,PER=1%,as specified by[1].
49dB channel spacing
[1]requires0dB
Wanted signal–82dBm,adjacent modulated channel at
Alternate-channel rejection,10-MHz10MHz,PER=1%,as specified by[1]
57dB channel spacing
[1]requires30dB
Wanted signal–82dBm,adjacent modulated channel at
Alternate-channel rejection,–10-MHz–10MHz,PER=1%,as specified by[1]
57dB channel spacing
[1]requires30dB
Channel rejection Wanted signal at–82dBm.Undesired signal is an IEEE
802.15.4modulated channel,stepped through all channels dB ≥20MHz57
from2405to2480MHz.Signal level for PER=1%.57≤–20MHz
Wanted signal at–82dBm.Undesired signal is802.15.4
Co-channel rejection modulated at the same frequency as the desired signal.Signal–3dB
level for PER=1%.
Blocking/desensitization
5MHz from band edge Wanted signal3dB above the sensitivity level,CW jammer,–33
10MHz from band edge PER=1%.Measured according to EN300440class2.–33
20MHz from band edge–32
dBm 50MHz from band edge–31
–5MHz from band edge–35
–10MHz from band edge–35
–20MHz from band edge–34
–50MHz from band edge–34
Spurious emission.Only largest spurious
Conducted measurement with a50-?single-ended load.
emission stated within each band.
Suitable for systems targeting compliance with EN300328,dBm
30MHz–1000MHz≤80
EN300440,FCC CFR47Part15,and ARIB STD-T-66.
1GHz–12.75GHz–57
Frequency error tolerance(1)[1]requires minimum80ppm±150ppm Symbol rate error tolerance(2)[1]requires minimum80ppm±1000ppm
Sensitivity impact of USB operation Measured on CC2531dongle reference design with CDC bulk
0.5dB
transfer to PC at maximum speed
(1)Difference between center frequency of the received RF signal and local oscillator frequency
(2)Difference between incoming symbol rate and the internally generated symbol rate
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RF TRANSMIT SECTION
Measured on Texas Instruments CC2530EM reference design with T A=25°C,V DD=3V and f c=2440MHz,unless otherwise noted.
Boldface limits apply over the entire operating range,T A=–40°C to125°C,V DD=2V to3.6V,and f c=2394MHz to2507 MHz.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Delivered to a single-ended50-?load through a balun using
0 4.58
maximum-recommended output-power setting
Nominal output power dBm
[1]requires minimum–3dBm–810 Programmable output power32dB range
Spurious emissions Max recommended output power setting(1)
Measured according to stated regulations.
Only largest spurious emission25MHz–1000MHz(outside restricted bands)–60
stated within each band.25MHz–2400MHz(within FCC restricted bands)–60
25MHz–1000MHz(within ETSI restricted bands)–60
1800–1900MHz(ETSI restricted band)–57
5150–5300MHz(ETSI restricted band)–55
dBm
At2×f c and3×f c(FCC restricted band)–42
At2×f c and3×f c(ETSI EN300-440and EN300-328)(2)–31
1GHz–12.75GHz(outside restricted bands)–53
At2483.5MHz and above(FCC restricted band)
f c=2480MHz(3)–42
Measured as defined by[1]using maximum-recommended
output-power setting
Error vector magnitude(EVM)2%
[1]requires maximum35%.
Differential impedance as seen from the RF port(RF_P and RF_N)
Optimum load impedance69+j29?
towards the antenna
(1)Texas Instruments CC2530EM reference design is suitable for systems targeting compliance with EN300328,EN300440,FCC
CFR47Part15,and ARIB STD-T-66.
(2)Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected
between matching network and RF connector(1.8pF in parallel with1.6nH);this filter must be connected to a good RF ground.
(3)Margins for passing FCC requirements at2483.5MHz and above when transmitting at2480MHz can be improved by using a lower
output-power setting or having less than100%duty cycle.
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32-MHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Crystal frequency32MHz Crystal frequency accuracy
–4040ppm requirement(1)
ESR Equivalent series resistance660?
C0Crystal shunt capacitance17pF
C L Crystal load capacitance1016pF
Start-up time0.3ms
The crystal oscillator must be in power down for a
guard time before it is used again.This
Power-down guard time requirement is valid for all modes of operation.The3ms
need for power-down guard time can vary with
crystal type and load.
(1)Including aging and temperature dependency,as specified by[1]
32.768-kHz CRYSTAL OSCILLATOR
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Crystal frequency32.768kHz
Crystal frequency accuracy
–4040ppm requirement(1)
ESR Equivalent series resistance40130k?
C0Crystal shunt capacitance0.92pF
C L Crystal load capacitance1216pF
Start-up time0.4s (1)Including aging and temperature dependency,as specified by[1]
32-kHz RC OSCILLATOR
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Calibrated frequency(1)32.753kHz Frequency accuracy after calibration±0.2%
Temperature coefficient(2)0.4%/°C Supply-voltage coefficient(3)3%/V Calibration time(4)2ms
(1)The calibrated32-kHz RC oscillator frequency is the32-MHz XTAL frequency divided by977.
(2)Frequency drift when temperature changes after calibration
(3)Frequency drift when supply voltage changes after calibration
(4)When the32-kHz RC oscillator is enabled,it is calibrated when a switch from the16-MHz RC oscillator to the32-MHz crystal oscillator
is performed while SLEEPCMD.OSC32K_CALDIS is0.
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16-MHz RC OSCILLATOR
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Frequency(1)16MHz Uncalibrated frequency accuracy±18%
Calibrated frequency accuracy±0.6%±1%
Start-up time10m s Initial calibration time(2)50m s
(1)The calibrated16-MHz RC oscillator frequency is the32-MHz XTAL frequency divided by2.
(2)When the16-MHz RC oscillator is enabled,it is calibrated when a switch from the16-MHz RC oscillator to the32-MHz crystal oscillator
is performed while SLEEPCMD.OSC_PD is set to0.
RSSI/CCA CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RSSI range100dB Absolute uncalibrated RSSI/CCA accuracy±4dB RSSI/CCA offset(1)73dB Step size(LSB value)1dB (1)Real RSSI=Register value–offset
FREQEST CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT FREQEST range±250kHz FREQEST accuracy±40kHz FREQEST offset(1)20kHz Step size(LSB value)7.8kHz (1)Real FREQEST=Register value–offset
FREQUENCY SYNTHESIZER CHARACTERISTICS
Measured on Texas Instruments CC2530EM reference design with T A=25°C,V DD=3V and f c=2440MHz,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
At±1-MHz offset from carrier–110
Phase noise,unmodulated carrier At±2-MHz offset from carrier–117dBc/Hz
At±5-MHz offset from carrier–122
ANALOG TEMPERATURE SENSOR
Measured on Texas Instruments CC2530EM reference design with T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output at25°C148012-bit ADC Temperature coefficient 4.5/1°C Voltage coefficient1/0.1V
Measured using integrated ADC,using
Initial accuracy without calibration±10°C
internal bandgap voltage reference and
maximum resolution
Accuracy using1-point calibration(entire
±5°C temperature range)
Current consumption when enabled(ADC
0.5mA current not included)
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ADC CHARACTERISTICS
T A=25°C and V DD=3V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input voltage V DD is voltage on AVDD5pin0V DD V
External reference voltage V DD is voltage on AVDD5pin0V DD V
External reference voltage differential V DD is voltage on AVDD5pin0V DD V
Input resistance,signal Using4-MHz clock speed197k?
Full-scale signal(1)Peak-to-peak,defines0dBFS 2.97V
Single-ended input,7-bit setting 5.7
Single-ended input,9-bit setting7.5
Single-ended input,10-bit setting9.3
Single-ended input,12-bit setting10.8
ENOB(1)Effective number of bits bits
Differential input,7-bit setting 6.5
Differential input,9-bit setting8.3
Differential input,10-bit setting10.0
Differential input,12-bit setting11.5 Useful power bandwidth7-bit setting,both single and differential0–20kHz
Single-ended input,12-bit setting,–6dBFS–75.2
THD(1)Total harmonic distortion dB
Differential input,12-bit setting,–6dBFS–86.6
Single-ended input,12-bit setting70.2
Differential input,12-bit setting79.3 Signal to nonharmonic ratio(1)dB
Single-ended input,12-bit setting,–6dBFS78.8
Differential input,12-bit setting,–6dBFS88.9
Differential input,12-bit setting,1-kHz sine(0
CMRR Common-mode rejection ratio>84dB
dBFS),limited by ADC resolution
Single-ended input,12-bit setting,1-kHz sine
Crosstalk>84dB
(0dBFS),limited by ADC resolution
Offset Midscale–3mV
Gain error0.68%
12-bit setting,mean0.05
DNL(1)Differential nonlinearity LSB
12-bit setting,maximum0.9
12-bit setting,mean 4.6
INL(1)Integral nonlinearity LSB
12-bit setting,maximum13.3
Single-ended input,7-bit setting35.4
Single-ended input,9-bit setting46.8
Single-ended input,10-bit setting57.5
Single-ended input,12-bit setting66.6
SINAD(1)
Signal-to-noise-and-distortion dB (–THD+N)Differential input,7-bit setting40.7
Differential input,9-bit setting51.6
Differential input,10-bit setting61.8
Differential input,12-bit setting70.8
7-bit setting20
9-bit setting36 Conversion time m s
10-bit setting68
12-bit setting132 Power consumption 1.2mA
Internal reference voltage 1.15V
Internal reference VDD coefficient4mV/V
Internal reference temperature coefficient0.4mV/10°C (1)Measured with300-Hz sine-wave input and VDD as reference.
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RESET
CC2531F128,CC2531F256
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CONTROL INPUT AC CHARACTERISTICS
T A=–40°C to125°C,V DD=2V to3.6V,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT System clock,f SYSCLK The undivided system clock is32MHz when crystal oscillator is used.
The undivided system clock is16MHz when calibrated16-MHz RC1632MHz
t SYSCLK=1/f SYSCLK
oscillator is used.
See item1,Figure1.This is the shortest pulse that is recognized as
a complete reset pin request.Note that shorter pulses may be
RESET_N low duration1m s recognized but might not lead to complete reset of all modules within
the chip.
See item2,Figure1.This is the shortest pulse that is recognized as
Interrupt pulse duration20ns an interrupt request.
Figure1.Control Input AC Characteristics
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SCK
SSN
MOSI
MISO
T0478-01
CC2531F128,CC2531F256
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SPI AC CHARACTERISTICS
T A =–40°C to 125°C,VDD =2V to 3.6V,unless otherwise noted.
PARAMETER TEST CONDITIONS
MIN TYP MAX
UNIT SCK period Master,RX and TX 250
ns
SCK duty cycle
Master 50%
t 2SSN low to SCK Master 63ns t 3SCK to SSN high Master
63
ns t 4MOSI early out Master,load =10pF 7ns t 5MOSI late out Master,load =10pF 10
ns t 6MISO setup Master 90ns t 7MISO hold Master
10ns t 1SCK period Slave,RX and TX 250
ns
SCK duty cycle Slave 50%
t 2SSN low to SCK Slave 63ns t 3SCK to SSN high Slave
63
ns t 8MISO early out Slave,load =10pF 0ns t 9MISO late out Slave,load =10pF 95
ns t 10MOSI setup Slave 35ns t 11
MOSI hold
Slave
10
ns
Master,TX only
8Master,RX and TX 4Operating frequency
MHz
Slave,RX only 8Slave,RX and TX
4
Figure 2.SPI Master AC Characteristics
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T0479-01
SCK
SSN
MOSI
MISO
CC2531F128,CC2531F256
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SWRS086A –SEPTEMBER 2009–REVISED JUNE 2010
Figure 3.SPI Slave AC Characteristics
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DEBUG _CLK
P2_2
T0436-01
RESET _N
DEBUG _CLK
P2_2
T0437-01
CC2531F128,CC2531F256
SWRS086A –SEPTEMBER 2009–REVISED JUNE 2010
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DEBUG INTERFACE AC CHARACTERISTICS
T A =–40°C to 125°C,V DD =2V to 3.6V,unless otherwise noted.
PARAMETER
TEST CONDITIONS MIN TYP MAX UNIT f clk_dbg Debug clock frequency (see Figure 4)12
MHz t 1Allowed high pulse on clock (see Figure 4)35ns t 2Allowed low pulse on clock (see Figure 4)35ns EXT_RESET_N low to first falling edge on t 3167ns debug clock (see Figure 5)
Falling edge on clock to EXT_RESET_N high t 483ns (see Figure 5)
EXT_RESET_N high to first debug command t 583ns (see Figure 5)
t 6Debug data setup (see Figure 6)2ns t 7Debug data hold (see Figure 6)4
ns t 8
Clock-to-data delay (see Figure 6)
Load =10pF
30
ns
Figure 4.Debug Clock –Basic Timing
Figure 5.Data Setup and Hold Timing
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DEBUG _CLK
P2_2
DEBUG _DATA DEBUG _DATA T0438-01
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Figure 6.Debug Enable Timing
TIMER INPUTS AC CHARACTERISTICS
T A =–40°C to 125°C,V DD =2V to 3.6V,unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT Synchronizers determine the shortest input pulse that can be t SYSCLK
Input capture pulse duration
recognized.The synchronizers operate at the current system 1.5
clock rate (16or 32MHz).
DC CHARACTERISTICS
T A =25°C,VDD =3V,unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT Logic-0input voltage 0.5
V Logic-1input voltage 2.5V Logic-0input current Input equals 0V –5050nA Logic-1input current
Input equals V DD
–50
50
nA I/O-pin pullup and pulldown resistors 20
k ?Logic-0output voltage,4-mA pins Output load 4mA 0.5V Logic-1output voltage,4-mA pins Output load 4mA 2.4
V Logic-0output voltage,20-mA pins Output load 20mA 0.5
V Logic-1output voltage,20-mA pins
Output load 20mA
2.4V
USB INTERFACE DC CHARACTERISTICS
T A =25°C,V DD =3V to 3.6V,unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT USB pad voltage output,high VDD 3.6V,4-mA load 3.4V USB pad voltage output,low
VDD 3.6V,4-mA load
0.2
V
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P 0_1
R E S E T _N
P 2_3/X O S C 32K _Q 2
A V D D 6
RBIAS
P 0_2
P 0_0
AVDD4P 0_3
AVDD1P 0_4
AVDD2P 0_5
RF_N P 0_6
RF_P P 0_7
AVDD3XOSC_Q1P 1_0
XOSC_Q2AVDD5
P 2_2
P 2_4/X O S C 32K _Q 1
P 2_1
P 2_0
P 1_7
DVDD_USB
P 1_6
P1_4D V D D 1
P1_3P1_1D C O U P L
P1_2DVDD2
USB_N USB_P DGND_USB
P1_5CC2531F128,CC2531F256
SWRS086A –SEPTEMBER 2009–REVISED JUNE 2010
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DEVICE INFORMATION
RHA PACKAGE (TOP VIEW)
NOTE:The exposed ground pad must be connected to a solid ground plane,as this is the ground connection for the chip.
Pin Descriptions
PIN NAME PIN PIN TYPE DESCRIPTION
AVDD128Power (analog)2-V–3.6-V analog power-supply connection AVDD227Power (analog)2-V–3.6-V analog power-supply connection AVDD324Power (analog)2-V–3.6-V analog power-supply connection AVDD429Power (analog)2-V–3.6-V analog power-supply connection AVDD521Power (analog)2-V–3.6-V analog power-supply connection AVDD631Power (analog)2-V–3.6-V analog power-supply connection
DCOUPL 40Power (digital) 1.8-V digital power-supply decoupling.Do not use for supplying external circuits.DGND_USB 1Ground (USB USB Ground
pads)DVDD139Power (digital)2-V–3.6-V digital power-supply connection DVDD210Power (digital)2-V–3.6-V digital power-supply connection DVDD_USB 4Power (USB 3.3V USB power supply connection
Pads)GND —Ground The ground pad must be connected to a solid ground plane.P0_019Digital I/O Port 0.0P0_118Digital I/O Port 0.1P0_217Digital I/O Port 0.2P0_316Digital I/O Port 0.3P0_415Digital I/O Port 0.4P0_514
Digital I/O
Port 0.5
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Pin Descriptions(continued)
PIN NAME PIN PIN TYPE DESCRIPTION
P0_613Digital I/O Port0.6
P0_712Digital I/O Port0.7
P1_011Digital I/O Port1.0–20-mA drive capability
P1_19Digital I/O Port1.1–20-mA drive capability
P1_28Digital I/O Port1.2
P1_37Digital I/O Port1.3
P1_46Digital I/O Port1.4
P1_55Digital I/O Port1.5
P1_638Digital I/O Port1.6
P1_737Digital I/O Port1.7
P2_036Digital I/O Port2.0
P2_135Digital I/O Port2.1
P2_234Digital I/O Port2.2
P2_3/Digital I/O,Port2.3/32.768kHz XOSC
33
XOSC32K_Q2analog I/O
P2_4/Digital I/O,Port2.4/32.768kHz XOSC
32
XOSC32K_Q1analog I/O
RBIAS30Analog I/O External precision bias resistor for reference current
RESET_N20Digital input Reset,active-low
Negative RF input signal to LNA during RX
RF_N26RF I/O
Negative RF output signal from PA during TX
25Positive RF input signal to LNA during RX
RF_P RF I/O
Positive RF output signal from PA during TX
USB_N3USB I/O USB differential data minus(D–)
USB_P2USB I/O USB differential data plus(D+)
XOSC_Q122Analog I/O32-MHz crystal oscillator pin1or external-clock input
XOSC_Q223Analog I/O32-MHz crystal oscillator pin2
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P2_4P2_3P2_2P2_1P2_0P1_4P1_3P1_2P1_1P1_0
P1_7P1_6P1_5P0_4P0_3P0_2P0_1P0_0
P0_7
P0_6P0_5XOSC_Q2CC2531F128,CC2531F256
SWRS086A –SEPTEMBER 2009–REVISED JUNE 2010
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CIRCUIT DESCRIPTION
Figure https://www.doczj.com/doc/5b4742272.html,2531Block Diagram
A block diagram of the CC2531is shown in Figure 7.The modules can be roughly divided into one of three categories:CPU-and memory-related modules;modules related to peripherals,clocks,and power management;and radio-related modules.In the following subsections,a short description of each module that appears in Figure 7is given.
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