歐盟豁免匯總
中文供參考：
1~10為原指令的附件
1.紧凑型萤光灯管中的汞的含量不超过5mg/盏灯。
Mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2.直管萤光灯中的汞一般不超过:
Mercury in straight fluorescent lamps for general purposes not exceeding
—卤代磷酸汞盐: 10 mg
—一般寿命的三磷酸汞盐: 5 mg
—较长寿命的三磷酸汞盐: 8 mg
—halophosphate 10 mg
—triphosphate with normal lifetime 5 mg
—triphosphate with long lifetime 8 mg
3.有特殊用途的直萤光灯管中的汞
Mercury in straight fluorescent lamps for special purposes
4.本附件中没有特别提及的其它类型的灯管中的汞
Mercury in other lamps not specifically mentioned in this Annex
5.陰極射線管、電子零部件和螢光管的玻璃中的鉛。
Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6.作為構成合金的元素,鋼合金中鉛的質量百分比最大為0.35％,鋁合金中
鉛的質量百分比最大為0.4％,銅合金中鉛的質量百分比最大為4％。
Lead as an alloying element in steel containing up to 0.35 % lead by weight, aluminum alloy containing up to 0.4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.
7.—铅在高熔点类焊锡中的应用（如：含铅量達到或超过85 wt %的铅錫焊
料），
—用于服务器、存储器或存储排列系统(豁免到2010年)，
—用於切换、信号传输和发送的网络设备,以及通讯网络管理设备焊料中的鉛，
—电子陶瓷部件中的铅(如压电器件)。
—Lead in high melting temperature type solders (i.e. tin-lead alloys containing 85 % by weight or more lead),
—lead in solders for servers, storage and storage array systems (exemption granted until 2010),
—lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication,
—lead in electronic ceramic parts (e.g. Piezoelectronic devices).
注:Sony在SS-00259中對此項目的定義“電子陶瓷部件[壓電元件,陶瓷感應材料,磁性材料(鐵氧體)]”
電子陶瓷按照不同的性能和用途,一般分為:絕緣陶瓷、介電陶瓷、壓電陶瓷、磁性陶瓷、半導體陶瓷、紅外感測器用陶瓷和透明陶瓷等。鐵氧體則是磁性陶瓷的重要代表，所謂鐵氧體,是以三價鐵離子為主要成分的氧化物的化學總稱。
8.电触点和镉电镀中镉及其化合物，但不包括第91/338/EEC号指令中所
禁止使用的镉,该指令是對76/769/EEC指令关于销售、使用和製備中某
些危险物质的限制的修订。
Cadmium and its compounds in electrical contacts and cadmium plating，except for applications banned under directive 91/338/EEC amending directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations
在91/338/EC中规定了镉不能应用于为最终产品着色，聚合物如聚氯乙烯的稳定剂等，且该指令列出了产品的清单,其中包含了PVC,低密度聚乙烯(LD PE),聚亚氨脂(PUR),醋酸丁酸纤维素等等。
9.在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬
Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators
十溴联苯醚是一种高效的阻燃剂,其使用不仅拯救了生命,而且还减少了与火相关的损伤。2005年10月15日，欧盟将RoHS指令中的十溴联苯醚（Deca-BDE）的使用限制进行豁免。这项决定基于欧盟一项长达10年的环境与人类健康评估报告的结论，同时，十溴联苯醚（Deca-BDE）生产商和使用商联合启动了一项旨在降低其扩散的项目。
欧洲溴化阻燃剂工业小组主席Dieter Drohmann博士宣称:这项决议是有强有力的科学支持的,对于全世界那些选择Deca-BDE作为其阻燃剂的电子制造厂商来说这是个让人放心的消息。它在提供一个可预见的商业环境同时也在欧洲或其它地方促成了更高的竞争现象。
10.根據指令7（2）條提及的程序，歐盟應評價以下的應用
—十溴聯苯醚
—有特殊用途的直萤光灯管中的汞
—用于服务器、存储器或存储排列系统、及切换、信号传输和发送的网络设备,以及通讯网络管理设备焊料中的鉛（旨在設定本豁免的截止時間）
—燈泡
Within the procedure referred to in Article 7(2), the Commission shall evaluate the
applications for:
— Deca BDE,
— mercury in straight fluorescent lamps for special purposes,
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption), and
— light bulbs,
以下是2005/747/EC（2005.10.21）的內容（11~15條豁免為此文件增加）
（A〃point 7 is replaced by the following:
‘7. — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead),
— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
—lead in electronic ceramic parts (e.g. piezoelectronic devices).
（B〃point 8 is replaced by the following:
‘8. Cadmiu m and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use of certain dangerous substances and preparations.）
11.在適应针连接器系统中使用的鉛
Lead used in compliant pin connector systems
12.用於热导组件C形環涂层中的铅
Lead as a coating material for the thermal conduction module c-ring
13.光学和滤光玻璃中被允许含有的铅和镉。
Lead and cadmium in optical and filter glass
A.放映机上的含铅玻璃
B.某些特定种类的镜头,例如救生设备和某些专业照相机上的镜头
C.某些梯度折射镜头
D.微型的平板印刷设备
E.某些高品质的打印机
F.目前不在RoHS指令范围内的其它的一些应用场合,也即:医疗設備和监控仪器。
因为添加了各种材料,所以光学滤光镜是“有颜色的”。这些材料必須具备
热稳定性,因为它们是玻璃的组成部分。使用铅和镉可以得到特别的颜色。这些滤光镜的产量相对比较小,但是它们的应用场合很广泛,大多被用在医疗设备、监控仪器和军事设备中。
14.微处理器針脚(pin)和封装联接(package) 所使用的含两种以上组分的焊料
中的铅（含铅量在80%与85%之间）
Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight
15.集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料
中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages
以下是2006/310/EC（2006. 04.21）的內容（16~20條豁免為此文件增加）
16.帶矽酸鹽塗層管的管型白熾燈中的鉛
Lead in linear incandescent lamps with silicate coated tubes
17.用於專業複印設備的高強度放電(HID)燈中作為激发媒介的鹵化鉛
Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications
18.当放电灯用於含磷的仿日晒灯如BSP（BaSi2O5:Pb）以及含磷的重氮复印
平版印刷，捕虫器，光化学和食物加工过程的特种灯如SMS ［（Sr,Ba)2MgSi2O7:Pb］時，放电灯中的荧光粉活化剂的含铅量不超過1wt%；
Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as specialty lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS (Sr,Ba)2MgSi2O7:Pb).
19.紧凑型节能灯（ESL）中作为主要汞齐合金的特定成分（PbBiSn-Hg和
PbInSn-Hg）中的铅以及作为辅助汞合金PbSn-Hg中的铅；
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL)
20.用於液晶顯示器(LCD)中焊接前後平板螢光燈基質的玻璃中的氧化鉛
Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD)
以下是2006/691/EC(2006. 10.12)的內容（21~27條豁免為此文件增加）
21.用于硼硅酸盐玻璃瓷釉的印墨所含的铅及镉；
Lead and cadmium in printing inks for the application enamels on borosilicate glass
22.于光纤通讯系统的法拉第旋转器中稀土铁石榴石法拉第轉子中作为杂质
的铅。
Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fiber optic communications systems.
23.细间距元件（除镍铁引线框架间距为0.65毫米或更小的连接器外）涂层
中含铅，以及细间距元件（除铜引线框架间距为0.65毫米或更小的连接
器外）涂层中含铅
Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with copper lead frames
24.連接通孔盒状及平面阵列陶瓷多层电容器焊料所含的铅；
Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors
25.等离子显示屏（PDP）及表面传导式电子发射显示器（SED）的部件所用
的氧化铅，特別是前後玻璃絕緣層、總線電極、黑紋、地址電極、柵格、
密封圈以及印刷漿體。
Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes
26.蓝黑灯管（BLB）玻璃外罩所含的氧化铅；
Lead oxide in the glass envelope of Black Light Blue (BLB) lamps
27.在大功率扬声器(在125dB及以上工作數小時)中作为转换器焊料的铅合
金。
Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125dB SPL and above) loudspeakers
以下是2006/692/EC(2006. 10.12)的內容（28條豁免為此文件增加）
28.未涂层金属板的防腐蚀性涂料、以及用于2002/96/EC指令第三条中规定
设备（信息及电讯设备）的防腐蚀及电磁干扰屏蔽的緊固件中的六价铬。
准予豁免的截止日期为2007年7月1日
Hexavalent chromium in corrosive preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July
2007
以下是2006/690/EC(2006. 10.12)的內容（29條豁免為此文件增加）
29.由2003年加入法（Act of Accession）最后修订的第36页指令——理事会
指令69/493/EEC OJ L 326, 29.12.1969中附录1（1、2、3、4类）中说明
的结晶玻璃中的铅。
Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3, and 4) of Council Directive 69/493/EEC（OJ L 326, 29.12.1969, p. 36. Directive as last amended by 2003 Act of Accession）
以下是2008/385/EC(2008. 1.24)的內容（30~32條豁免為此文件增加）
30. 在高功率揚聲器（100dB及以上）的轉換器的聲音線圈中用於焊接電導體的電子/機構焊料的鎘合金。
30 Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil,in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.
31. 用於無汞平面熒光燈（如液晶顯示器、指定或工業光源）的焊料中的鉛。31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal,displays, design or industrial lighting).
32. 用於制造氬氪激光管的窗口組件的密封環中的氧化鉛。
32. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes.’
以下是2009/428/EC(2009. 6.4)的內容
修訂22條：從2009.12.31起，用於光纖通信的法拉第轉子中的稀土鐵石榴石中的鉛雜質將不再豁免。
‘22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communication systems until 31 December 2009.’
以下是2009/443/EC(2009. 6.10)的內容（33~38條豁免為此文件增加）
33. 電源變壓器中直徑100微米及以下細銅線所用焊料中的鉛
‘33. Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers.
34. 金屬陶瓷質的微調電位計中的鉛
34. Lead in cermet-based trimmer potentiometer elements.
35.專業音頻設備的光耦合器中使用的光敏電阻的鎘。豁免至2009年12月31日止
35. Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009.
36.直流等离子顯示器中陰极濺射抑制劑中的汞，其含量不得超過30毫克/顯示器。豁免至2010年7月1日止
36. Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010.
37. 以硼酸鋅玻璃体為基礎的高壓二极管的電鍍層的鉛
37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.
38. 用氧化鈹連接鋁制成的厚膜漿料中鎘和氧化鎘
38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.’.