HUAWEI MC323 CDMA M2M Module Hardware Guide
Issue 02
Date 2010-11-08
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About This Document
History
Version
Date
Chapter Descriptions 01 2010-10-21
Creation
3.4.1 Revised “Overview”
3.4.2 Revised “Input Signal Control Pins” 3.4.3 Revised “Output Signal Control Pin” 2010-10-28
7
Revised “Figure 7-1 Circuits of typical
interfaces in the MC323 module”
3.4.2 Revised “Input Signal Control Pins” 3.4.3 Revised “Output Signal Control Pin” 02
2010-11-037
Revised “Figure 7-1 Circuits of typical
interfaces in the MC323 module”
Contents
1 Introduction (1)
1.1 Overview (1)
2 Overall Description (2)
2.1 Function Overview (2)
2.2 Circuit Block Diagram (3)
2.3 Application Block Diagram (4)
3 Description of the Application Interfaces (6)
3.1 B2B Connector Interface (6)
3.2 Power Interface (8)
3.2.1 Overview (8)
3.2.2 VBAT Interface (9)
3.2.3 VCOIN Interface (9)
3.2.4 VIO Interface (10)
3.3 Power-On, Power-Off and Reset Time Sequence (10)
3.3.1 Overview (10)
3.3.2 Power-On Time Sequence (11)
3.3.3 Power-Off Time Sequence (12)
3.3.4 RESET (12)
3.4 Signal Control Interface (12)
3.4.1 Overview (12)
3.4.2 Input Signal Control Pins (13)
3.4.3 Output Signal Control Pin (15)
3.5 UART Interface (17)
3.5.1 Overview (17)
3.5.2 Circuit Recommended for the UART Interface (18)
3.6 RUIM Card Interface (19)
3.6.1 Overview (19)
3.6.2 Circuit Recommended for the RUIM Card Interface (19)
3.6.3 ESD Protection for the RUIM Card Interface (21)
3.7 USB Interface (21)
4 RF Specifications (23)
4.1 Working Bands (23)
4.2 Conducted RF Measurements (23)
4.2.1 Test Environment (23)
4.2.2 Test Standards (24)
4.3 Conducted RF Features (24)
4.3.1 Conducted Signal Receiving Sensitivity (24)
4.3.2 Conducted Transmitting Power (24)
4.4 Requirements of Antenna Design (25)
4.5 Environment for Antenna Test (25)
4.6 Antenna Installation (26)
4.7 Coaxial Cable and RF Connector (27)
4.8 ESD Protection for the Antenna Interface (29)
5 Electrical and Reliability Features (30)
5.1 Extreme Working Conditions (30)
5.2 Working and Storage Temperatures and Humidity (31)
5.3 Electrical Criteria of Application Interfaces (32)
5.4 Power Supply Features (32)
5.4.1 Input Power Supply (32)
5.4.2 Working Current (33)
5.5 Reliability Features (33)
5.6 ESD Features (35)
6 Structure (36)
6.1 Dimensions (36)
6.2 Dimensions of the B2B Connector (38)
6.3 MC323 Module Installation Description (39)
6.4 Specification Selection for Fasteners (41)
7 Appendix A: Circuits of Typical Interfaces (43)
8 Appendix B: Acronyms and Abbreviations (44)
Tables
Table 2-1 Feature (2)
Table 3-1 Definition of pins on a 50-pin B2B connector (7)
Table 3-2 Definitions of the pins on the power supply interface (8)
Table 3-3 Capacitance corresponding to different SMPLs (9)
Table 3-4 Definitions of pins of the power-on/power-off and reset interfaces (10)
Table 3-5 Pins on the signal control interface (13)
Table 3-6 Status of the LEDS pin (15)
Table 3-7 UART interface signals (17)
Table 3-8 RUIM card interface signals (19)
Table 3-9 Definition of the USB interface (22)
Table 4-1 Work Bands of MC323 Module (23)
Table 4-2 Signal receiving sensitivity of the MC323 module (24)
Table 4-3 Transmitting power of the MC323 module (25)
Table 4-4 Recommended parameter for antenna design (25)
Table 4-5 Major specifications of the RF connector (27)
Table 5-1 Extreme working conditions for the MC323 module (30)
Table 5-2 Working and storage temperatures and humidity for the MC323 module (31)
Table 5-3 Electrical features of the MC323 application interfaces (32)
Table 5-4 Requirements for input power of the MC323 module (32)
Table 5-5 Working current of the MC323 module (33)
Table 5-6 Test conditions and results of the reliability of the MC323 module (33)
Table 5-7 ESD performance (35)
Table 6-1 Ordered connector model and DF12 product series working with the MC323 module (38)
Figures
Figure 2-1 Circuit block diagram of the MC323 module (4)
Figure 2-2 Application block diagram of the MC323 module (5)
Figure 3-1 Pin direction on an MC323 module (7)
Figure 3-2 Circuit of VCOIN interface (10)
Figure 3-3 MC323 TERM_ON and RESET signals (11)
Figure 3-4 Power-on time sequence (11)
Figure 3-5 Power-off time sequence (12)
Figure 3-6 Connections of the TERM_ON, RESET and MODEM_WAKEUP pins (14)
Figure 3-7 Sleep mode control time sequence (15)
Figure 3-8 Wakeup module via TERM_ON time sequence (15)
Figure 3-9 Driving circuit of LED or HOST_WAKEUP (16)
Figure 3-10 Connection of the UART interface in the MC323 module (DCE) with the host (DTE) (18)
Figure 3-11 The signal through the /RING after the MC323 receives an SM (18)
Figure 3-12 The signal through the /RING after the MC323 receives a voice call (19)
Figure 3-13 Drive circuit of the RUIM card (20)
Figure 3-14 Placing direction of an RUIM card socket (20)
Figure 3-15 ESD protection circuit on the RUIM card (21)
Figure 3-16 USB interface parameters (22)
Figure 4-1 Environment for antenna test (26)
Figure 4-2 RF connector dimensions (27)
Figure 4-3 Specifications of the coaxial cable working with the RF connector (28)
Figure 4-4 Connection between the RF connector and the U.FL-LP-040 cable (28)
Figure 4-5 ESD protection circuit recommended for the antenna interface (29)
Figure 6-1 Dimensions of the MC323 module (unit: mm) (37)
Figure 6-2 DF12C (manufactured by Hirose) used on the MC323 module (38)
Figure 6-3 DF12E (manufactured by Hirose) recommended to be used with the MC323 module on
the user interface board (38)
Figure 6-4 Dimensions of the connector used on the MC323 module (unit: mm) (39)
Figure 6-5 Structure fixing hole (39)
Figure 6-6 MC323 module installation (40)
Figure 6-7 Machine screw dimensions (41)
Figure 6-8 Nut dimensions (41)
Figure 6-9 Metal fastener dimensions (42)
Figure 7-1 Circuits of typical interfaces in the MC323 module (43)
1
Introduction
1.1 Overvi se in elopment guide documents are also provided with the odule, which can be obtained through Huawei website.
MC323 has two formats: Data only or Telematics. The Data only format doesn’t support the voice function.
ew
This document describes the hardware application interfaces and air interfaces that are provided when the Huawei MC323 CDMA2000 1X M2M module (hereinafter referred to as the MC323 module) is used.
This document helps you to understand the interface specifications, electrical
features, and related product information of the MC323 module. To facilitate its u different fields, relevant dev m
2
Overall Description
About Thi cription of the MC323 module and provides:
z Function Overview z Circuit Block Diagram iagram
2.1 Functio rview T s Chapter
This chapter gives a general des z
Application Block D n Ove
able 2-1 Feature Feature Description
Working bands Two supported frequency bands: CDMA2000 1X 800/1900MHz
Normal working temperature: –20°C to +70°C
Working temperature
Extreme working temperatures: –30°C to –20°C and +70°C to +75°C Ambient
temperatur storage e for -40°C to 85°C
Power voltage
3.3–
4.2V (3.8 V is recommended.)
Protocols IS-2000 AT commands See the HUAWEI MC323 CDMA Module AT Command Interface Specification .
8 wire UART (maximum rate: 230.4 kbps)
Application
interface (50-pin B2B connector)
ompatible with 3 V and 1.8 V power Standard RUIM card (c voltage)
Feature Description
USB 2.0 full-speed interface Power on/off interface Hardware reset interface Power interface
External wake up/sleep interface
Interface for one channel of 2.85 V digital power output Module status light-emitting diode (LED) control interface
Hirose U.FL-R-SMT-1(80) 50 ohm antenna connector Antenna interface Antenna pad
Support MO and MT SMS Support SMS in .txt format
CDMA2000 1X(rel.0): UL 153.6 kbps /DL 153.6 kbps Data Services Embedded with TCP/IP protocols, supporting multiple links
Physical features z Dimensions (L × W × H): 35 mm × 32.5 mm × 3.05 mm z
Weight: 6.0 g
Certification information
se of certain Hazardous Substances (RoHS), Federal Communications Commission (FCC), European Conformity (CE),China Compulsory Certification (CCC)and CMIIT
Restriction of the u
2.2 Circuit Figu ule. The major nc g unit: integrated with a Mobile Station Modem (MSM), an RF er Manager Chip (PMIC) mory (NOR Flash + PSRAM) z z Antenna interface z
50-Pin B2B interface
Block Diagram
re 2-1 shows the circuit block diagram of the MC323 mod fu tional units of the MC323 module contain the following parts:
z Central processin Transceiver (RTR), and a Pow (MCP) me z Multi-Chip Package z 19.2MHz crystal
Radio Frequency (RF) circuit
Figure 2-1 Circuit block diagram of the MC323 module
2.3 Application Block Diagram
The application interfaces of the MC323 module contain the following parts:
z UART serial port
z RUIM card (compatible with 1.8 V and 3.0 V power voltage)
z USB 2.0 full-speed interface
z Interface for receiving external power supply
z Power-on/Power-off and reset interfaces
z Module status LED
z Sleep/Wake Up control
Figure 2-2 Application block diagram of the MC323 module
3
Description of the Application Interfaces
About Thi is escribes the external application interfaces of the MC323 and Reset Time Sequence nterface z UART Interface z RUIM Card Interface 3.1 B2B Connector Interface
tails of the B2B connector, see "6.2 Dimensions of the B2B Connector".
Figure 3-1 shows the sequence and definitions of pins on the 50-pin B2B signal interface of the MC323 module.
s Chapter
Th chapter mainly d module, including:
z B2B Connector Interface z Power Interface
z Power-On, Power-Off z Signal Control I z
USB Interface
The MC323 module uses a 50-pin B2B connector as its external interface. For de about the model and dimensions
Figure 3-1 Pin direction on an MC323 module
Table 3-1 Definition of pins on a 50-pin B2B connector
Pin No. Signal Name I/O Pin No. Signal Name I/O
1 R_UIM_CLK O
2 NC
3 VREG_RUIM P
4 NC
6 NC
5 R_UIM_DATA I/O
7 R_UIM_RST_N O 8 NC
9 NC 10 NC
11 GND - 12 NC
13 HOST_WAKEUP O 14 NC
I 16 NC
15 MODEM_WAKEUP
17 USB_D- I/O 18 GND - 19 USB_D+ I/O 20 TERM_ON O 21 NC 22 RESET I 23 NC 24 /DCD O 25 LED O 26 NC
27 NC 28 /CTS_OUT O 29 /RXD_OUT O 30 NC
31 NC 32 /DTR I 33 /TXD_IN I 34 /RTS_IN I 35 VCOIN P 36 /DSR O 37 NC 38 /RING O
Pin No. Signal Name I/O Pin No. Signal Name I/O
39 NC 40 VIO P
41 GND - 42 VBAT P
43 GND - 44 VBAT P
45 GND - 46 VBAT P
47 GND - 48 VBAT P
49 GND - 50 VBAT P
z P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital
signal output; AI indicates pins for analog signal input; AO indicates pins for analog signal
output.
z The NC pin is not in use. Disconnect the pin and make sure it is not grounded, pulled up,
and pulled down.
3.2 Power Interface
3.2.1 Overview
The power supply part of the B2B interface of the MC323 module contains:
z VBAT interface for the power supply
z VIO interface for external power output
z VCOIN interface for the standby power supply for Sudden Momentary Power Loss (SMPL) protection
Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
Pin No. Signal Name I/O Description
42, 44, 46, 48, 50 VBAT P Pins for power voltage input
(3.3 V~4.2 V)
41, 43, 45, 47, 49 GND - GND
35 VCOIN P Pin for standby power
40 VIO P Pin for external power output
(2.85 V).
3.2.2 VBAT Interface
When the MC323 module works normally, power is supplied through the VBAT pins
and the voltage ranges from 3.3 V to 4.2 V (typical value: 3.8 V). The 50-pin B2B
connector provides five VBAT pins and five GND pins for external power input. To
ensure that the MC323 module works normally, all the pins must be used efficiently.
When the MC323 module is used for different external applications, pay special
attention to the design for the power supply. When the MC323 module transmits
signals at the maximum power, in this case, the VBAT voltage drops due to the
differences in actual network environments. Make sure that the voltage does not
decrease below 3.3 V in any case. Otherwise, exceptions such as restart of the
MC323 module may occur.
A low-dropout (LDO) regulator or switch power with current output of more than 1.5 A
is recommended for external power supply. A 470μF or above bypass capacitor and a
0.1μF decouple capacitor are connected in a parallel manner on the power interface
of the MC323 module.
When the MC323 module is powered off, power is provided to the crystal and the real
time clock (RTC) through the VBAT interface. If power supply on the VBAT interface
is completely cut, the crystal and the RTC stop working.
For detailed information about power supply design and printed circuit board (PCB) design,
see the Guide to HUAWEI M2M Module Power Supply Design and the Guide to HUAWEI M2M
Module Peripheral PCB Design.
3.2.3 VCOIN Interface
The VCOIN interface is used against SMPL. When power supply of an MC323
module is cut accidentally, power can be provided through the VCOIN interface. The
VCOIN interface only needs to be connected to a storage capacitor without external
battery. The capacitance depends on the actual requirements.
Table 3-3 Capacitance corresponding to different SMPLs
SMPL Time Storage Capacitance
0.5 seconds 1.5μF
1 seconds 3.3μF
2 seconds 4.7μF
Figure 3-2 Circuit of VCOIN interface
3.2.4 VIO Interface
Through the VIO interface, the MC323 module can supply 2.85 V power externally
with a maximum drive current of 10mA for external level conversion or other
applications.
If the MC323 module is in Sleep mode, the VIO interface is in the low power
consumption state. In this case, there is no load and the typical value is 5μA. If the
MC323 module is in Power-off mode, the VIO is in the disabled state.
3.3 Power-On, Power-Off and Reset Time Sequence
3.3.1 Overview
The power-on, power-off, and reset control parts of the B2B interface of the MC323
module includes power-on/power-off interface signal (TERM_ON) and the hardware
reset interface signal (RESET). Table 3-4 lists the definitions of the interface pins.
Table 3-4 Definitions of pins of the power-on/power-off and reset interfaces
Pin No. Signal Name I/O Description
20 TERM_ON I Pin for controlling power-on and
power-off
22 RESET I Pin for resetting the hardware
3.3.2 Power-On Time Sequence
z Make sure that the MC323 module is powered on at the voltage and working temperature in the recommended range. Otherwise, the module may get
damaged or work improperly.
z External application interfaces must be powered on after the module is powered on.
An MC323 module can be powered on when a low-level pulse in an extreme short
time of 100 ms is provided through the TERM_ON pin, as shown in Figure 3-3. The
VIO voltage increases after 18 ms and a 2.85 V voltage is supplied through the VIO
interface. Figure 3-4 shows the specific power-on time sequence.
Figure 3-3 MC323 TERM_ON and RESET signals
[1] For specific setting information about the power-on/power-off software, see the HUAWEI
MC323 CDMA M2M Module AT Command Interface Specification.
Figure 3-4 Power-on time sequence
After power is supplied through the VBAT interface for 20 ms, a low-level signal is provided
through the TERM_ON pin to trigger module power-on. When the MC323 module is powered
on and initialized after 3s, users can use the module.
3.3.3 Power-Off Time Sequence
An MC323 module can be powered off through the TERM_ON pin. When a low-level
pulse is supplied through the TERM_ON pin for more than 2s, the MC323 module will
be powered off. Figure 3-5 shows the power-off time sequence.
Figure 3-5 Power-off time sequence
When a low-level pulse is supplied through the TERM_ON pin for more than 2s, the MC323
module will be powered off. The power-off process lasts about 1.5s.
3.3.4 RESET
The MC323 module supports hardware reset function. If the software of the MC323
module stops responding, you can reset the hardware through the RESET signal, as
shown in Figure 3-3. When a low-level pulse is supplied through the RESET pin for
more than 10 ms, the hardware will be reset. After hardware reset, the software is
enabled, as shown in Figure 3-4. The software reports related information according
to the actual settings.
The low-level pulse through the RESET pin cannot last for more than 2s. Otherwise, the
MC323 module will be powered off.
3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the B2B interface in the MC323 module consists of:
z Power-on/off (TERM_ON) pin