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MMG3011NT1;中文规格书,Datasheet资料

MMG3011NT1;中文规格书,Datasheet资料
MMG3011NT1;中文规格书,Datasheet资料

MMG3011NT1

MMG3011NT1

0--6000MHz,15dB

15dBm InGaP HBT

Heterojunction Bipolar Transistor (InGaP HBT)

Broadband High Linearity Amplifier

The MMG3011NT1is a general purpose amplifier that is internally input and output matched.It is designed for a broad range of Class A,small--signal,high linearity,general purpose applications.It is suitable for applications with frequencies from 0to 6000MHz such as cellular,P C S ,B WA ,W L L ,P H S ,C AT V,V H F,U H F,U M T S a n d g e n e r a l small--signal RF.

Features

?Frequency:0to 6000MHz ?P1dB:15dBm @900MHz

?Small--Signal Gain:15dB @900MHz

?Third Order Output Intercept Point:28dBm @900MHz ?Single 5Volt Supply

?Internally Matched to 50Ohms

?Cost--effective SOT--89Surface Mount Package

?In Tape and Reel.T1Suffix =1000Units,12mm Tape Width,7inch Reel.

Table 1.Typical Performance (1)

Characteristic Symbol 900MHz 2140MHz 3500MHz Unit Small--Signal Gain (S21)

G p 151412dB Input Return Loss (S11)

IRL --18--25--25dB Output Return Loss (S22)

ORL --25--18--17dB Power Output @1dB Compression P1dB 1513.513.5dBm Third Order Output Intercept Point

OIP3

28

26.5

26

dBm

1.V CC =5Vdc,T A =25°C,50ohm system.

Table 2.Maximum Ratings

Rating

Symbol Value Unit Supply Voltage V CC 6V Supply Current I CC 80mA RF Input Power

P in 10dBm Storage Temperature Range T stg --65to +150

°C Junction Temperature (2)

T J

150

°C

2.For reliable operation,the junction temperature should not exceed 150°C.

Table 3.Thermal Characteristics

Characteristic

Symbol Value (3)

Unit Thermal Resistance,Junction to Case

Case Temperature 87°C,5Vdc,41mA,no RF applied

R θJC

83

°C/W

3.Refer to AN1955,Thermal Measurement Methodology of RF Power Amplifiers.Go to https://www.doczj.com/doc/1b16024327.html,/rf.Select Documentation/Application Notes --AN1955.

Document Number:MMG3011NT1

Rev.6,2/2012

Freescale Semiconductor Technical Data

2

RF Device Data

Freescale Semiconductor,Inc.

MMG3011NT1Table 4.Electrical Characteristics (V CC =5Vdc,900MHz,T A =25°C,50ohm system,in Freescale Application Circuit)

Characteristic

Symbol Min Typ Max Unit Small--Signal Gain (S21)G p 13.515—dB Input Return Loss (S11)IRL —--18—dB Output Return Loss (S22)

ORL —--25—dB Power Output @1dB Compression P1dB —15—dBm Third Order Output Intercept Point OIP3—28—dBm Noise Figure NF — 4.6—dB Supply Current (1)I CC 324148mA Supply Voltage (1)

V CC

5

V

1.For reliable operation,the junction temperature should not exceed 150°C.

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MMG3011NT1

3

RF Device Data

Freescale Semiconductor,Inc.

Table 5.Functional Pin Description

Pin Number

Pin Function

1RF in 2Ground

3

RF out /DC Supply

Table 6.ESD Protection Characteristics

Test Methodology

Class Human Body Model (per JESD 22--A114)1A Machine Model (per EIA/JESD 22--A115)A Charge Device Model (per JESD 22--C101)

IV

Table 7.Moisture Sensitivity Level

Test Methodology

Rating Package Peak Temperature

Unit Per JESD 22--A113,IPC/JEDEC J--STD--020

1

260

°C

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4

RF Device Data Freescale Semiconductor,Inc.

MMG3011NT150OHM TYPICAL

CHARACTERISTICS

5

20

f,

FREQUENCY(GHz)

Figure2.Small--Signal

Gain(S21)versus

Frequency

15

10

1234

G

p

,

S

M

A

L

L

--

S

I

G

N

A

L

G

A

I

N

(

d

B

)

4

--40

f,FREQUENCY(GHz)

Figure3.Input/Output Return Loss versus

Frequency

--10

--20

--30

123

S

1

1

,

S

2

2

(

d

B

)

15

10

17

5

P out,OUTPUT POWER(dBm)

Figure4.Small--Signal Gain versus Output

Power

16

15

14

13

12

7

11

3.5

3

2.5

2

1.5

1

0.5

10

17

16

15

13

11

f,FREQUENCY(GHz)

Figure5.P1dB versus Frequency

P

1

d

B

,

1

d

B

C

O

M

P

R

E

S

S

I

O

N

P

O

I

N

T

(

d

B

m

)

14

12

5.4

80

4

V CC,COLLECTOR VOLTAGE(V)

Figure6.Collector Current versus Collector

Voltage

60

40

10

4.25

5.2

I

C

C

,

C

O

L

L

E

C

T

O

R

C

U

R

R

E

N

T

(

m

A

)

20

4.4 4.6 4.84

15

30

f,FREQUENCY(GHz)

Figure7.Third Order Output Intercept Point

versus Frequency

27

24

21

18

123

O

I

P

3

,

T

H

I

R

D

O

R

D

E

R

O

U

T

P

U

T

I

N

T

E

R

C

E

P

T

P

O

I

N

T

(

d

B

m

)

11

G

p

,

S

M

A

L

L

--

S

I

G

N

A

L

G

A

I

N

(

d

B

)

50

30

913

70

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MMG3011NT1

5

RF Device Data

Freescale Semiconductor,Inc.

50OHM TYPICAL

CHARACTERISTICS

18334.9

V CC ,COLLECTOR VOLTAGE (V)

Figure 8.Third Order Output Intercept Point

versus Collector Voltage

30272421O I P 3,T H I R D O R D E R O U T P U T I N T E R C E P T P O I N T (d B m )

4.95

5

5.1

5.05

100

--40

--20

20

40

60

80

2431T,TEMPERATURE (_C)

Figure 9.Third Order Output Intercept Point

versus Case Temperature

29282726O I P 3,T H I R D O R D E R O U T P U T I N T E R C E P T P O I N T (d B m )

25Figure 10.Third Order Intermodulation Distortion

versus Output Power

P out ,OUTPUT POWER (dBm)

I M D ,T H I R D O R D E R I N T E R M O D U L A T I O N D I S T O R T I O N (d B c )

--6

--3

3

6

--80--30--50--60--70--40150

103

105

120

Figure 11.MTTF versus Junction Temperature

104

125

130

135

140

145

T J ,JUNCTION TEMPERATURE (°C)

NOTE:The MTTF is calculated with V CC =5Vdc,I CC =41mA

M T T F (Y E A R S )

4

08

f,FREQUENCY (GHz)

Figure 12.Noise Figure versus Frequency

6

4

2

1

2

3

N F ,N O I S E F I G U R E (d B )

--70

--20--3

P out ,OUTPUT POWER (dBm)

Figure 13.Single--Carrier W--CDMA Adjacent

Channel Power Ratio versus Output Power

--30--40--50--609

6

A C P R ,A D J A C E N T C H A N N E L P O W E R R A T I O (d

B c )

12

30

3

12

9

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6

RF Device Data

Freescale Semiconductor,Inc.

MMG3011NT150OHM APPLICATION CIRCUIT:40--300MHz

Figure 14.50Ohm Test Circuit Schematic

V Figure 15.S21,S11and S22versus Frequency --40

200

f,FREQUENCY (MHz)

200

300

400

500

100--10--20--30Figure 16.50Ohm Test Circuit Component Layout

Z1,Z50.347″x 0.058″Microstrip Z20.575″x 0.058″Microstrip Z3

0.172″x 0.058″Microstrip

Z40.403″x 0.058″Microstrip

PCB Getek Grade ML200C,0.031″,εr =4.1

S 21,S 11,S 22(d B )

100

Table 8.50Ohm Test Circuit Component Designations and Values

Part

Description

Part Number Manufacturer C1,C2,C30.01μF Chip Capacitors C0603C103J5RAC Kemet C41000pF Chip Capacitor C0603C102J5RAC Kemet L1470nH Chip Inductor BK2125HM471--T Taiyo Yuden R1

0ΩChip Resistor

ERJ3GEY0R00V

Panasonic

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MMG3011NT1

7

RF Device Data

Freescale Semiconductor,Inc.

50OHM APPLICATION CIRCUIT:300--3600MHz

Figure 17.50Ohm Test Circuit Schematic

V Figure 18.S21,S11and S22versus Frequency --4020f,FREQUENCY (MHz)

800

100--10--20Figure 19.50Ohm Test Circuit Component Layout

Z1,Z50.347″x 0.058″Microstrip Z20.575″x 0.058″Microstrip Z3

0.172″x 0.058″Microstrip

Z40.403″x 0.058″Microstrip

PCB Getek Grade ML200C,0.031″,εr =4.1

S 21,S 11,S 22(d B )

1300

300

1800

2300

2800

3300

3800

--30Table 9.50Ohm Test Circuit Component Designations and Values

Part

Description

Part Number Manufacturer C1,C2150pF Chip Capacitors C0603C151J5RAC Kemet C30.01μF Chip Capacitor C0603C103J5RAC Kemet C41000pF Chip Capacitor C0603C102J5RAC Kemet L156nH Chip Inductor HK160856NJ--T Taiyo Yuden R1

0ΩChip Resistor

ERJ3GEY0R00V

Panasonic

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8

RF Device Data Freescale Semiconductor,Inc.

MMG3011NT150OHM TYPICAL CHARACTERISTICS

https://www.doczj.com/doc/1b16024327.html,mon Emitter S--Parameters(V CC=5Vdc,T A=25°C,50Ohm System)

f MHz

S11S21S12S22

|S11|∠φ|S21|∠φ|S12|∠φ|S22|∠φ

1000.06552170.033 5.96942176.2630.09975--0.8160.13385--2.955 1500.06383167.931 5.93739174.1550.09991--1.180.13500--4.514 2000.06269165.117 5.91539171.5270.10015--2.4770.13601--6.374 2500.06117162.063 5.89348169.5460.10045--2.8830.13724--9.6

3000.05981158.66 5.87619167.5180.10063--3.340.13832--12.707 3500.05830154.766 5.86975165.3980.10085--4.050.14046--14.848 4000.05702150.967 5.85785163.3770.10108--4.5060.14191--17.031 4500.05620147.157 5.84533161.3030.10131--5.1590.14371--19.568 5000.05480143.805 5.83028159.190.10142--5.7660.14461--21.523 5500.05404139.862 5.81371157.1920.10154--6.2530.14562--23.875 6000.05345136.215 5.79406155.1720.10159--6.830.14624--25.878 6500.05300132.595 5.77608153.1330.10166--7.4490.14664--28.005 7000.05301129.164 5.75924151.1350.10172--7.9850.14651--30.174 7500.05337125.784 5.73951149.1080.10177--8.6080.14648--32.244 8000.05401122.842 5.71885147.0930.10184--9.1780.14551--34.496 8500.05502120.061 5.69616145.0640.10204--9.7460.14435--36.557 9000.05607117.736 5.67188143.0660.10209--10.3190.14281--38.707 9500.05712115.541 5.65082141.1120.10222--10.9150.14087--40.982 10000.05849113.614 5.62851139.1090.10236--11.5060.13859--43.169 10500.06056112.274 5.60006137.1590.10243--12.1030.13641--45.576 11000.06216111.255 5.57557135.1690.10254--12.710.13320--47.809 11500.06385110.823 5.55100133.2020.10280--13.3060.12952--50.265 12000.06581110.396 5.52258131.2310.10297--13.8920.12567--52.695 12500.06795110.14 5.49787129.2890.10307--14.5590.12169--55.267 13000.07029110.037 5.47256127.3590.10327--15.2030.11718--57.902 13500.06417110.3 5.44429125.4320.10350--15.8510.11263--60.543 14000.06615110.33 5.41593123.5310.10367--16.460.10814--63.335 14500.06834110.566 5.38670121.6270.10385--17.0390.10311--66.301 15000.07037111.203 5.35727119.730.10409--17.6820.09824--69.317 15500.06361106.262 5.33305117.890.10444--18.3240.09725--65.446 16000.06510104.31 5.304151160.10462--18.9390.09352--67.448 16500.06709103.387 5.26958114.1250.10474--19.6560.09017--69.038 17000.06871101.77 5.24166112.2510.10505--20.2940.08614--71.347 17500.07086100.502 5.21283110.4130.10523--20.9450.08224--73.345 18000.0732899.404 5.18411108.5490.10547--21.5770.07847--75.924 18500.0757798.261 5.15395106.6740.10576--22.3750.07419--78.51 19000.0784597.17 5.12325104.8490.10592--23.0120.07045--81.64 19500.0809696.588 5.09284102.9960.10612--23.7420.06627--85.166 20000.0837895.835 5.06020101.1840.10637--24.4190.06270--88.825 20500.0871094.791 5.0301599.3460.10667--25.0360.05860--93.023 21000.0895794.206 5.0017597.5190.10686--25.8350.05542--97.743 21500.0916093.044 4.9697795.7150.10722--26.5910.05191--103.413 22000.0958092.472 4.9354193.9260.10725--27.2530.04928--109.11 22500.0980191.352 4.9042592.1250.10767--27.9310.04677--115.508

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MMG3011NT1

9

RF Device Data

Freescale Semiconductor,Inc.

50OHM TYPICAL CHARACTERISTICS

Table https://www.doczj.com/doc/1b16024327.html,mon Emitter S--Parameters (V CC =5Vdc,T A =25°C,50Ohm System)(continued)

f MHz S 11

S 21

S 12

S 22

|S 11|∠φ|S 21|∠φ|S 12|∠φ|S 22|∠φ23000.1012590.343 4.8721590.3270.10777--28.670.04452--122.29623500.1038489.16 4.8406488.5610.10817--29.3940.04294--129.54124000.1070288.397 4.8059786.770.10841--30.2110.04205--138.124500.1100887.519 4.7737385.0060.10869--30.9240.04158--146.36325000.1124186.11 4.7385283.2890.10879--31.6610.04157--154.57825500.1154085.045 4.7108081.530.10916--32.4080.04231--162.98426000.1182483.877 4.6776579.8030.10931--33.2030.04340--171.0626500.1209082.346 4.6461678.0610.10958--33.9290.04508--178.59127000.1234081.156 4.6137276.3240.10994--34.6210.04725174.36627500.1260679.687 4.5806374.6050.10994--35.4440.05010167.16228000.1292278.399 4.5502272.8810.11034--36.2460.05315160.78128500.1314477.016 4.5186371.1720.11063--37.030.05620154.62429000.1342875.734 4.4905769.4950.11089--37.7540.06004149.45129500.1371374.325 4.4536667.7340.11109--38.640.06342144.06530000.1391472.892 4.4253666.0610.11140--39.4070.06743138.97230500.1432071.422 4.3973064.3870.11161--40.1640.07181134.7731000.1461370.248 4.3656162.6980.11191--40.9680.07596130.07931500.1489869.069 4.3342061.0070.11211--41.8610.08043125.99232000.1526467.768 4.3055659.3160.11252--42.740.08543122.13832500.1565666.632 4.2744657.6480.11258--43.5280.09047117.96333000.1594865.655 4.2447955.9840.11281--44.4480.09540114.2933500.1632564.574 4.2154654.3010.11317--45.2470.10082110.96734000.1669463.679 4.1874352.6380.11329--46.1340.10661107.41234500.1711362.876 4.1574050.9610.11352--46.9920.11195104.19235000.1749362.049 4.1268849.2880.11374--47.8560.11808101.20435500.1790661.193 4.0989247.630.11391--48.7680.1240498.1823600

0.18310

60.522

4.06981

45.971

0.11410

--49.604

0.13009

95.337

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10

RF Device Data

Freescale Semiconductor,Inc.

MMG3011NT1

Figure 20.Recommended Mounting Configuration

NOTES:

1.THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN.

2.DEPENDING ON PCB DESIGN RULES,AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.

3.IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN,THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE.

4.RECOMMENDED VIA PATTERN SHOWN HAS 0.381x 0.762MM PITCH.

Recommended Solder Stencil

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分销商库存信息: FREESCALE

MMG3011NT1

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